February brings the debut of PACK EXPO East to Philadelphia Feb. 16-18. The first processing and packaging trade show specifically for Northeastern manufacturers is owned and produced by PMMI, The Association for Packaging and Processing Technologies, known for its portfolio of PACK EXPO trade shows. With nearly one-third of the nation’s top CPGs located within 200 miles of Philadelphia, the Northeastern United States is a critical center of manufacturing. Meanwhile, the significant growth of the region’s microbreweries and dairy industry continues to add to the momentum. New York state’s microbreweries jumped 160 percent in the past three years, while its dairy manufacturers produced of yogurt, 16 percent of U.S. yogurt (741 million pounds) in 2013. Located in the heart of Philadelphia, PACK EXPO East will meet the needs of this vibrant, yet previously underserved, Northeastern manufacturing marketplace. PACK EXPO East will be a resource for food brands, processors, and packagers seeking the latest solutions and insights to improve the sustainability, efficiency productivity and security of the manufacturing supply chain. The show’s several educational features will guide attendees to the suppliers and information they need: • The Innovation Stage (Booth #696) will be home to educational talks on breakthrough technologies and other innovations presented by the industry’s leading solutions providers. These free 30-minute seminars will be conveniently located on the show floor. • The Education Pavilion (Booth #697) will serve as a convenient source of information on industry-related training, and certificate and degree programs. Staffed by representatives from colleges and universities as well as PMMI, this feature will also provide opportunities for attendees to learn about PMMI’s educational offerings, including the Mechatronics Certificate Test and the PMMI Certified Trainer Program.   • The Packaging Design Studio (Booth #1067), presented by Rutgers University’s Packaging Engineering Program, will bring the future of packaging […]